Invention Grant
- Patent Title: Insulating material and printed circuit board having the same
- Patent Title (中): 绝缘材料和具有相同的印刷电路板
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Application No.: US13137935Application Date: 2011-09-21
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Publication No.: US08209862B2Publication Date: 2012-07-03
- Inventor: Jong-Seok Song
- Applicant: Jong-Seok Song
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0139192 20071227
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
An insulating material formed by impregnating a base material with a liquid composition and curing the liquid composition, the liquid composition being 20 to 50 parts by weight of a PMDA-ODA mixture, the PMDA-ODA mixture including pyromellitic dianhydride (PMDA) and oxydianiline (ODA) mixed in a weight ratio of 40:60 to 60:40; 50 to 80 parts by weight of a triazine derivative; and 300 to 600 parts by weight of an organic solvent. A printed circuit board includes an insulator formed of the above insulating material; a circuit pattern formed on one or either side of the insulator; and a via penetrating the insulator.
Public/Granted literature
- US20120012375A1 Insulating material and printed circuit board having the same Public/Granted day:2012-01-19
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