A method and apparatus for modular pipe repair, the method comprising attaching two enclosure halves over a leak in a pipe to assemble a first repair enclosure and determining if another repair enclosure is needed for another leak in the pipe. If another repair enclosure is needed, the method further comprises drilling in the first repair enclosure drill hole passages in selected angled grooves thereof to connect to a primary groove in the enclosure, attaching a second repair enclosure to pipe, drilling in the second repair enclosure drill hole passages in selected angled grooves thereof to connect to the primary groove in the second enclosure, and attaching hub clamps to the first repair enclosure and the second repair enclosure. Finally, the method comprises injecting sealant into a plurality of injection points to fill the selected angled grooves and the primary grooves in the repair enclosures.