Invention Grant
- Patent Title: Structure and apparatus for cooling integrated circuits using cooper microchannels
- Patent Title (中): 使用铜芯微通道冷却集成电路的结构和装置
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Application No.: US12177020Application Date: 2008-07-21
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Publication No.: US08210243B2Publication Date: 2012-07-03
- Inventor: Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
- Applicant: Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: F. Chau & Associates, LLC
- Agent Louis J. Percello, Esq.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20
Abstract:
A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
Public/Granted literature
- US20100012294A1 Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels Public/Granted day:2010-01-21
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