Invention Grant
- Patent Title: Hydraulic elevating platform assembly
- Patent Title (中): 液压升降台组件
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Application No.: US11897558Application Date: 2007-08-31
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Publication No.: US08210319B2Publication Date: 2012-07-03
- Inventor: John W. Boyd , William P. Whitwell , George Hicks , Ronnie D. Hicks , Timothy J. Dimmick
- Applicant: John W. Boyd , William P. Whitwell , George Hicks , Ronnie D. Hicks , Timothy J. Dimmick
- Applicant Address: US SC Denmark
- Assignee: John W. Boyd
- Current Assignee: John W. Boyd
- Current Assignee Address: US SC Denmark
- Agency: J. Bennett Mullinax LLC
- Main IPC: B66B9/04
- IPC: B66B9/04 ; B66B1/32 ; B66B1/28
Abstract:
An elevating platform assembly is provided. In accordance with one exemplary embodiment a platform is present and is moveable along a travel distance of a mast. A cylinder is provided and is capable of being actuated. The cylinder is used to move the platform along the travel distance.
Public/Granted literature
- US20090057067A1 Hydraulic elevating platform assembly Public/Granted day:2009-03-05
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