Invention Grant
- Patent Title: Taped component and method of mounting product using the same
- Patent Title (中): 胶带组件及其使用方法
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Application No.: US11969249Application Date: 2008-01-04
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Publication No.: US08210357B2Publication Date: 2012-07-03
- Inventor: Masahiro Masuda , Yasunori Yanai , Yoshikazu Yagi
- Applicant: Masahiro Masuda , Yasunori Yanai , Yoshikazu Yagi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2007-058044 20070308
- Main IPC: B32B3/10
- IPC: B32B3/10 ; H05K3/30 ; H05K13/02 ; B65D85/86 ; B65D73/02
Abstract:
A taped component includes a career tape having an upper surface having recesses provided therein, and products stored in the recesses, respectively. Each of the recesses has a bottom on which each of the products is placed. The bottom has an aperture provided therein, and the aperture faces a position different from the center of gravity of each of the products. This taped component allows the product to be mounted efficiently.
Public/Granted literature
- US20080220208A1 TAPED COMPONENT AND METHOD OF MOUNTING PRODUCT USING THE SAME Public/Granted day:2008-09-11
Information query
