A thermally insulated applicator for applying heated thermoplastic liquid includes an applicator body including a thermoplastic liquid supply passage and a heating element for supplying heat to liquid in the supply passage. A dispensing valve module is coupled in thermal contact with the applicator body and includes an outlet in fluid communication with the liquid supply passage. A cover assembly is formed of a thermally insulating plastic and includes first, second and third sides, the first and second sides of the cover assembly respectively covering the first and second sides of the applicator body, and the third side of the cover assembly covering the third side of the dispensing valve module. The first and second sides of the cover assembly each include a plurality of point contact projecting elements respectively supporting the first and second sides of the cover assembly on the first and second sides of the applicator body.