Invention Grant
- Patent Title: Bump stopper for suspension system
- Patent Title (中): 用于悬挂系统的凸块塞
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Application No.: US12336326Application Date: 2008-12-16
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Publication No.: US08210508B2Publication Date: 2012-07-03
- Inventor: Seong Wook Hwang
- Applicant: Seong Wook Hwang
- Applicant Address: KR Seoul KR Seoul
- Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee: Hyundai Motor Company,Kia Motors Corporation
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2008-0048210 20080523
- Main IPC: F16F1/36
- IPC: F16F1/36 ; F16F7/00 ; F16F9/00 ; F16F11/00 ; B60G13/00 ; B60G15/00

Abstract:
A bump stopper for a suspension system that has at least a parting line along a longitudinal direction of the bumper stopper, may include at least two convex portions coaxially connected each other in the longitudinal direction of the bump stopper and contacting each other in a compressed state, a first array including first reinforcing blocks integrally formed on the respective convex portions along the parting line, each abutting first reinforcing block having a first contact angle therebetween in the longitudinal direction of the bumper stopper, and a second array including second reinforcing blocks integrally formed on the respective convex portions, each abutting second reinforcing block having a second contact angle therebetween in the longitudinal direction of the bumper stopper, wherein the first array is disposed with a predetermined angle from the first array along a circumferential direction of the bumper stopper.
Public/Granted literature
- US20090288923A1 BUMP STOPPER FOR SUSPENSION SYSTEM Public/Granted day:2009-11-26
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