Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US12391159Application Date: 2009-02-23
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Publication No.: US08210578B2Publication Date: 2012-07-03
- Inventor: Zi-Ming Tang
- Applicant: Zi-Ming Tang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810304874 20081010
- Main IPC: E05C9/10
- IPC: E05C9/10 ; E05C19/06

Abstract:
An electronic device enclosure includes a housing defining a latching groove, a cover defining a latching hook to engage in the latching groove, and an opening assembly mounted in the housing. The opening assembly includes a sliding member slidably positioned in the latching groove, and an operation member positioned in the housing and connected to sliding member. The sliding member defines an abutting surface on the sliding member. The operating member is capable of pulling the sliding member to slide along the latching groove, so that the abutting surface of the sliding member pushes against the latching hook and disengages the latching hook from the latching groove.
Public/Granted literature
- US20100090568A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2010-04-15
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