Invention Grant
US08210644B2 Liquid ejecting apparatus and method for cleaning the same 有权
液体喷射装置及其清洗方法

  • Patent Title: Liquid ejecting apparatus and method for cleaning the same
  • Patent Title (中): 液体喷射装置及其清洗方法
  • Application No.: US11622892
    Application Date: 2007-01-12
  • Publication No.: US08210644B2
    Publication Date: 2012-07-03
  • Inventor: Kenji Tsukada
  • Applicant: Kenji Tsukada
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JPP2002-181654 20020621; JPP2002-181655 20020621; JPP2003-172520 20030617
  • Main IPC: B41J2/165
  • IPC: B41J2/165
Liquid ejecting apparatus and method for cleaning the same
Abstract:
A liquid ejecting apparatus includes a liquid ejecting head having a plurality of nozzles for ejecting a liquid drop formed at a lower face thereof, a wiping member wiping an opening portion of the nozzle, a carriage mounted with the liquid ejecting head, and moving in a horizontal direction relative to the wiping member; and an inclined plate mounted on the carriage at a predetermined space from the liquid ejecting head, and formed with an inclined face having a rising inclination as being far from the liquid ejecting head. A projected portion is provided on at least one of the liquid ejecting head and the inclined plate such that an opening portion at a lower side of the space is smaller than an upper portion of the space.
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