Invention Grant
- Patent Title: Liquid ejecting apparatus
- Patent Title (中): 液体喷射装置
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Application No.: US12751769Application Date: 2010-03-31
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Publication No.: US08210646B2Publication Date: 2012-07-03
- Inventor: Eiichiro Watanabe
- Applicant: Eiichiro Watanabe
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2009-088707 20090401
- Main IPC: B41J2/15
- IPC: B41J2/15

Abstract:
A liquid ejecting apparatus includes a liquid ejecting head having a nozzle row in which nozzles are arrayed and eject liquid. A wiping member moves relative to a nozzle-forming surface of the liquid ejecting head and wipes the nozzle-forming surface along a direction that intersects a nozzle row direction. Caulking portions are exposed to the nozzle-forming surface. Insertion portions are exposed to the nozzle-forming surface and allow positioning members to be inserted therethrough. The nozzle-forming surface includes a first region ranging from a wiping start position for the wiping member to a nozzle row forming region in which the nozzle row is formed and a second, opposite, region. A first caulking portion is formed in the first region outside the nozzle row along the nozzle row direction, and a second caulking portion is formed in the second region inside the insertion portions along the nozzle row direction.
Public/Granted literature
- US20100253740A1 LIQUID EJECTING APPARATUS Public/Granted day:2010-10-07
Information query
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