A printing head is provided by which, even when the stress is caused by a connecting section between a printing element substrate-side electrode terminal and a lead when the connecting section is heated and is subsequently cooled, the connecting section can be suppressed from having a deteriorated reliability. The printing head is structured so that the electrode pads are connected to the inner leads via stud bumps. The connection between the electrode pad and the stud bump is performed by applying ultrasonic oscillation to the connecting part in the first direction while the electrode pad is having a contact with the stud bump. The connection between the inner lead and the stud bump is performed by applying ultrasonic oscillation to the connecting part in the second direction intersecting with the first direction while the inner lead is having a contact with the stud bump.