Invention Grant
- Patent Title: Method of assembling substrate transfer device and transfer system unit for the same
- Patent Title (中): 组装基板转移装置和转运系统装置的方法
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Application No.: US13017552Application Date: 2011-01-31
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Publication No.: US08210789B2Publication Date: 2012-07-03
- Inventor: Yasuhiko Hashimoto
- Applicant: Yasuhiko Hashimoto
- Applicant Address: JP Kobe-Shi
- Assignee: Kawasaki Jukogyo Kabushiki Kaisha
- Current Assignee: Kawasaki Jukogyo Kabushiki Kaisha
- Current Assignee Address: JP Kobe-Shi
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-062827 20050307
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
An assembly method of assembling a substrate transfer device including: a transfer system unit forming step of fixing a robot and a substrate container retainer to a divided body which composes a part of the substrate transfer device and is formed separably on a main structural body as a residual part of the substrate transfer device, thereby forming a transfer system unit; an operation examination step of examining whether the robot fixed to the transfer system unit can operate as a part of the substrate transfer device or not; and a mounting step of mounting the transfer system unit on the main structural body of the substrate transfer device after the operation examination step.
Public/Granted literature
- US20110123300A1 METHOD OF ASSEMBLING SUBSTRATE TRANSFER DEVICE AND TRANSFER SYSTEM UNIT FOR THE SAME Public/Granted day:2011-05-26
Information query
IPC分类: