Invention Grant
- Patent Title: Electrical socket assembly for electrically connecting adjacent circuit boards
- Patent Title (中): 用于电连接相邻电路板的电插座组件
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Application No.: US12886069Application Date: 2010-09-20
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Publication No.: US08210854B2Publication Date: 2012-07-03
- Inventor: David Patrick Orris
- Applicant: David Patrick Orris
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical socket assembly including a socket housing having coupling and flange portions and a contact cavity that extends through the coupling and flange portions along a central axis. The coupling and flange portions have different peripheral contours that extend about the central axis. The peripheral contour of the flange portion being sized and shaped to prevent the flange portion from advancing through a thru-hole of a circuit board. The socket assembly also includes a fastener that is configured to be secured to the coupling portion. The fastener and the flange portion have respective mating surfaces that face each other in opposite directions along the central axis. The respective mating surfaces are configured to grip the circuit board therebetween such that the socket housing has a fixed position relative to the circuit board. A conductive path exists between the power contact and the circuit board.
Public/Granted literature
- US20120071009A1 ELECTRICAL SOCKET ASSEMBLY FOR ELECTRICALLY CONNECTING ADJACENT CIRCUIT BOARDS Public/Granted day:2012-03-22
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