Invention Grant
- Patent Title: Board terminal
- Patent Title (中): 董事会终端
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Application No.: US12913940Application Date: 2010-10-28
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Publication No.: US08210856B2Publication Date: 2012-07-03
- Inventor: Koji Suzuki , Yuuji Saka
- Applicant: Koji Suzuki , Yuuji Saka
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2010-030687 20100215
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A board terminal is formed by cutting a metal wire material at a predetermined length, the metal wire material having a cross-sectional shape similar to and slightly larger than a terminal holding hole. A press-fit portion press-fitted to the terminal holding hole is pressure-forged in a direction orthogonal to an axis. Thereby, a tapered portion and a stepped edge portions are provided on both sides of the pressure-forging direction, the tapered portion tapering toward a press-fit direction, the stepped edge portion being provided to an end side of the tapered portion. Further, externally projected portions are provided to both sides of the press-fit portion in the direction orthogonal to the axis which is orthogonal to the pressure-forging direction.
Public/Granted literature
- US20110201237A1 BOARD TERMINAL Public/Granted day:2011-08-18
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