Invention Grant
US08210858B2 Socket device comprising grounding structure, application of socket device and manufacturing method thereof 有权
插座装置,包括接地结构,插座装置的应用及其制造方法

  • Patent Title: Socket device comprising grounding structure, application of socket device and manufacturing method thereof
  • Patent Title (中): 插座装置,包括接地结构,插座装置的应用及其制造方法
  • Application No.: US12965671
    Application Date: 2010-12-10
  • Publication No.: US08210858B2
    Publication Date: 2012-07-03
  • Inventor: Kuo-Liang LeeJuin-Kai Chuang
  • Applicant: Kuo-Liang LeeJuin-Kai Chuang
  • Applicant Address: TW Taoyuan Hsien
  • Assignee: Delta Electronics, Inc.
  • Current Assignee: Delta Electronics, Inc.
  • Current Assignee Address: TW Taoyuan Hsien
  • Priority: TW98142598A 20091211
  • Main IPC: H01R4/66
  • IPC: H01R4/66
Socket device comprising grounding structure, application of socket device and manufacturing method thereof
Abstract:
One embodiment of the present invention relates to a socket device comprising a base, a socket structure and a grounding structure. The base comprises a substrate and a sidewall adjacent thereto, and the substrate comprises a first lateral and a second lateral corresponded to each other. The socket structure is disposed on the sidewall of the base. The grounding structure is disposed on the substrate of the base and comprises a grounding element, a fixing element, a grounding wire, and an insulating plate. The grounding element comprises first and second terminals, wherein the first terminal is protruded from the first lateral of the substrate. The fixing element is substantially disposed on the second lateral of the substrate and connected to the second terminal of the grounding element, so as to fix the grounding element to the substrate.
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