Invention Grant
- Patent Title: Copper base rolled alloy and manufacturing method therefor
- Patent Title (中): 铜基轧制合金及其制造方法
-
Application No.: US12342613Application Date: 2008-12-23
-
Publication No.: US08211249B2Publication Date: 2012-07-03
- Inventor: Tetsuo Sakai , Naokuni Muramatsu , Koki Chiba , Naoki Yamagami
- Applicant: Tetsuo Sakai , Naokuni Muramatsu , Koki Chiba , Naoki Yamagami
- Applicant Address: JP Nagoya JP Suita-Shi
- Assignee: NGK Insulators, Ltd.,Osaka University
- Current Assignee: NGK Insulators, Ltd.,Osaka University
- Current Assignee Address: JP Nagoya JP Suita-Shi
- Agency: Burr & Brown
- Priority: JP2006-174419 20060623
- Main IPC: C12Q1/68
- IPC: C12Q1/68 ; C22F1/08

Abstract:
A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.
Public/Granted literature
- US20090165899A1 COPPER BASE ROLLED ALLOY AND MANUFACTURING METHOD THEREFOR Public/Granted day:2009-07-02
Information query