Invention Grant
- Patent Title: Wafer spin chuck and an etcher using the same
- Patent Title (中): 晶圆旋转卡盘和使用其的蚀刻器
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Application No.: US13190041Application Date: 2011-07-25
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Publication No.: US08211269B2Publication Date: 2012-07-03
- Inventor: Joo-Jib Park , Woo-Young Kim , Woo-Seok Lee
- Applicant: Joo-Jib Park , Woo-Young Kim , Woo-Seok Lee
- Applicant Address: KR
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2007-0106257 20071022
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
A wafer spin chuck and an etcher using the same are provided. According to an aspect of the present invention, there is provide a wafer spin chuck device comprising: a spin body which spins a wafer; and a stationary body which holds the spin body and is under the spin body with a space between the spin body and the stationary body, wherein the stationary body includes a blocking unit which blocks the space with a fluid.
Public/Granted literature
- US20110272871A1 Wafer Spin Chuck and an Etcher Using the Same Public/Granted day:2011-11-10
Information query
IPC分类:
