Invention Grant
- Patent Title: Non-fibrous high modulus ultra high molecular weight polyethylene tape for ballistic applications
- Patent Title (中): 用于弹道应用的非纤维高模量超高分子量聚乙烯胶带
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Application No.: US13135535Application Date: 2011-07-08
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Publication No.: US08211342B2Publication Date: 2012-07-03
- Inventor: Gene C. Weedon , Kenneth C. Harding , Lisa Owen
- Applicant: Gene C. Weedon , Kenneth C. Harding , Lisa Owen
- Applicant Address: US NC Monroe
- Assignee: Bae Systems Tensylon H.P.M., Inc.
- Current Assignee: Bae Systems Tensylon H.P.M., Inc.
- Current Assignee Address: US NC Monroe
- Main IPC: B29C43/26
- IPC: B29C43/26

Abstract:
A process for the production of a non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
Public/Granted literature
- US20110272848A1 Non-fibrous high modulus ultra high molecular weight polyethylene tape for ballistic applications Public/Granted day:2011-11-10
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