Invention Grant
- Patent Title: Low application temperature hot melt adhesive composition and articles including the same
- Patent Title (中): 低使用温度的热熔胶组合物和制品包括相同
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Application No.: US12270368Application Date: 2008-11-13
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Publication No.: US08211521B2Publication Date: 2012-07-03
- Inventor: Beth Eichler-Johnson , Vitaly Rogachevsky
- Applicant: Beth Eichler-Johnson , Vitaly Rogachevsky
- Applicant Address: US MN St. Paul
- Assignee: H.B. Fuller Company
- Current Assignee: H.B. Fuller Company
- Current Assignee Address: US MN St. Paul
- Agent Kirsten Stone; Kristi Halloran
- Main IPC: B32B7/10
- IPC: B32B7/10 ; B32B33/00 ; B32B7/12 ; B32B37/12
Abstract:
A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.
Public/Granted literature
- US20090120577A1 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE COMPOSITION AND ARTICLES INCLUDING THE SAME Public/Granted day:2009-05-14
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