Invention Grant
- Patent Title: Microelectronic security coatings
- Patent Title (中): 微电子安全涂料
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Application No.: US12815775Application Date: 2010-06-15
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Publication No.: US08211538B2Publication Date: 2012-07-03
- Inventor: Kenneth H. Heffner
- Applicant: Kenneth H. Heffner
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B41M3/14 ; B44F1/12

Abstract:
A security coating on an electronic circuit assembly comprises a mesh coating that may have a unique signature pattern and comprise materials that easily produce an image of the signature so that it is possible to determine if reverse engineering has been attempted. Spaces in the mesh may include electrical components to erase circuit codes to destroy the functionality and value of the protected die if the mesh coated is disturbed. The voids may include compositions to enhance the mesh signature and abrade the circuit if tampering takes place.
Public/Granted literature
- US20100254095A1 MICROELECTRONIC SECURITY COATINGS Public/Granted day:2010-10-07
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