Invention Grant
- Patent Title: Multilayer structure and process for producing the same
- Patent Title (中): 多层结构及其制造方法
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Application No.: US12094020Application Date: 2005-11-17
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Publication No.: US08211541B2Publication Date: 2012-07-03
- Inventor: Tomonori Murata , Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
- Applicant: Tomonori Murata , Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
- Applicant Address: JP Kurashiki-shi
- Assignee: Kuraray Co., Ltd.
- Current Assignee: Kuraray Co., Ltd.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2005/021140 WO 20051117
- International Announcement: WO2007/057960 WO 20070524
- Main IPC: B32B15/02
- IPC: B32B15/02 ; B32B15/085 ; B32B37/12 ; B32B37/14

Abstract:
A multilayer structure having a layer of an adhesive resin composition (A) and a layer of another resin (B), wherein the adhesive resin composition (A) includes a thermoplastic resin (a1) containing functional groups of at least one kind selected from the group consisting of a boronic acid group and boron-containing groups capable of being converted into a boronic acid group in the presence of water, and a polyolefin (a2) which does not contain the functional groups, the blending weight ratio (a1/a2) of the thermoplastic resin (a1) to the polyolefin (a2) is 1/99 to 15/85, and particles of the thermoplastic resin (a1) are dispersed with an average particle diameter of 0.1 to 1.2 μm in a matrix of the polyolefin (a2). Consequently, a multilayer structures having satisfactory interlayer adhesion strength can be provided even if the content of the resin having a special functional group in the adhesive resin composition layer is reduced.
Public/Granted literature
- US20080254279A1 Multilayer Structure and Process for Producing the Same Public/Granted day:2008-10-16
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