Invention Grant
US08211556B2 Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding
有权
具有增加的导热性和屏蔽衰减的石膏基建筑材料，用于生产建筑材料的方法，含有建筑材料的模制品和用于制造模制品的方法
- Patent Title: Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding
- Patent Title (中): 具有增加的导热性和屏蔽衰减的石膏基建筑材料，用于生产建筑材料的方法，含有建筑材料的模制品和用于制造模制品的方法
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Application No.: US11499294Application Date: 2006-08-04
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Publication No.: US08211556B2Publication Date: 2012-07-03
- Inventor: Werner Guckert , Winfried Spickermann , Heinz-Joachim Butz , Stephan Duckwitz , Dieter Ehlting
- Applicant: Werner Guckert , Winfried Spickermann , Heinz-Joachim Butz , Stephan Duckwitz , Dieter Ehlting
- Applicant Address: DE Wiesbaden DE Duesseldorf
- Assignee: SGL Carbon SE,Saint-Gobain Rigips GmbH
- Current Assignee: SGL Carbon SE,Saint-Gobain Rigips GmbH
- Current Assignee Address: DE Wiesbaden DE Duesseldorf
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: EP05016944 20050804
- Main IPC: B32B19/00
- IPC: B32B19/00 ; B32B9/00 ; B32B5/16
Abstract:
A gypsum-based building material having increased thermal conductivity and shielding attenuation, a method for producing the building material, a molding containing the building material and a method for producing the molding are provided. The products and methods include adding ground stock formed of compacted expanded graphite to gypsum-based building materials in order to increase the thermal conductivity and the electromagnetic shielding attenuation of the building materials and moldings, for example gypsum cardboards, produced therefrom.
Public/Granted literature
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