Invention Grant
- Patent Title: Semiconductor device and method of visual inspection and apparatus for visual inspection
- Patent Title (中): 目视检查用半导体装置及方法,目视检查装置
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Application No.: US13030717Application Date: 2011-02-18
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Publication No.: US08211718B2Publication Date: 2012-07-03
- Inventor: Hokuto Kumagai
- Applicant: Hokuto Kumagai
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2007-051704 20070301
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
A semiconductor device having the structure, which is adopted for the highly precise visual inspection with a lower cost, is achieved. A semiconductor device is a semiconductor device having a region for forming an electric circuit, and includes seal rings provided in an interconnect layer and surrounding the region for forming an electric circuit, and a dummy metal via provided in the interconnect layer and located outside of the seal rings. In a cross section perpendicular to an elongating direction of the seal ring, the width of the dummy metal via is smaller than the width of the seal ring.
Public/Granted literature
- US20110141268A1 SEMICONDUCTOR DEVICE AND METHOD OF VISUAL INSPECTION AND APPARATUS FOR VISUAL INSPECTION Public/Granted day:2011-06-16
Information query
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