Invention Grant
- Patent Title: Method of processing substrate and method of manufacturing substrate for use in liquid ejection head
- Patent Title (中): 基板的处理方法及液体喷射头用基板的制造方法
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Application No.: US12885257Application Date: 2010-09-17
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Publication No.: US08211719B2Publication Date: 2012-07-03
- Inventor: Hiroyuki Morimoto , Masahiko Kubota
- Applicant: Hiroyuki Morimoto , Masahiko Kubota
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Priority: JP2009-218924 20090924
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A substrate processing method includes preparing a substrate, a first mask adjacent to a first surface of the substrate and including a first light transmitting portion allowing light to be transmitted therethrough, a condenser adjacent to the first surface, a second mask including a second light transmitting portion, and a photo detecting member including a photo detecting portion detecting light having passed through the second light transmitting portion, the condenser condensing light having passed through the first light transmitting portion toward the second light transmitting portion, the second light transmitting portion allowing the light condensed by the condenser to be transmitted therethrough, and forming a recess in the substrate by laser beam irradiation from a direction opposite to the first surface. When an intensity of the laser beam detected by the photo detecting portion is at or above a specific intensity, the irradiation of the laser beam is stopped.
Public/Granted literature
- US20110070667A1 METHOD OF PROCESSING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE FOR USE IN LIQUID EJECTION HEAD Public/Granted day:2011-03-24
Information query
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