Invention Grant
US08211727B2 Group III nitride semiconductor multilayer structure and production method thereof 有权
III族氮化物半导体多层结构及其制备方法

  • Patent Title: Group III nitride semiconductor multilayer structure and production method thereof
  • Patent Title (中): III族氮化物半导体多层结构及其制备方法
  • Application No.: US13057696
    Application Date: 2009-07-30
  • Publication No.: US08211727B2
    Publication Date: 2012-07-03
  • Inventor: Kenzo HanawaYasumasa Sasaki
  • Applicant: Kenzo HanawaYasumasa Sasaki
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2008-203429 20080806
  • International Application: PCT/JP2009/063902 WO 20090730
  • International Announcement: WO2010/016532 WO 20100211
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Group III nitride semiconductor multilayer structure and production method thereof
Abstract:
According to the present invention, an AlN crystal film seed layer having high crystallinity is combined with selective/lateral growth, whereby a Group III nitride semiconductor multilayer structure more enhanced in crystallinity can be obtained. The Group III nitride semiconductor multilayer structure of the present invention is a Group III nitride semiconductor multilayer structure where an AlN crystal film having a crystal grain boundary interval of 200 nm or more is formed as a seed layer on a C-plane sapphire substrate surface by a sputtering method and an underlying layer, an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, each composed of a Group III nitride semiconductor, are further stacked, wherein regions in which the seed layer is present and is absent are formed on the C-plane sapphire substrate surface and/or regions capable of epitaxial growth and incapable of epitaxial growth are formed in the underlying layer.
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