Invention Grant
US08211727B2 Group III nitride semiconductor multilayer structure and production method thereof
有权
III族氮化物半导体多层结构及其制备方法
- Patent Title: Group III nitride semiconductor multilayer structure and production method thereof
- Patent Title (中): III族氮化物半导体多层结构及其制备方法
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Application No.: US13057696Application Date: 2009-07-30
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Publication No.: US08211727B2Publication Date: 2012-07-03
- Inventor: Kenzo Hanawa , Yasumasa Sasaki
- Applicant: Kenzo Hanawa , Yasumasa Sasaki
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-203429 20080806
- International Application: PCT/JP2009/063902 WO 20090730
- International Announcement: WO2010/016532 WO 20100211
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
According to the present invention, an AlN crystal film seed layer having high crystallinity is combined with selective/lateral growth, whereby a Group III nitride semiconductor multilayer structure more enhanced in crystallinity can be obtained. The Group III nitride semiconductor multilayer structure of the present invention is a Group III nitride semiconductor multilayer structure where an AlN crystal film having a crystal grain boundary interval of 200 nm or more is formed as a seed layer on a C-plane sapphire substrate surface by a sputtering method and an underlying layer, an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, each composed of a Group III nitride semiconductor, are further stacked, wherein regions in which the seed layer is present and is absent are formed on the C-plane sapphire substrate surface and/or regions capable of epitaxial growth and incapable of epitaxial growth are formed in the underlying layer.
Public/Granted literature
- US20110147763A1 GROUP III NITRIDE SEMICONDUCTOR MULTILAYER STRUCTURE AND PRODUCTION METHOD THEREOF Public/Granted day:2011-06-23
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