Invention Grant
US08211740B2 Solid state imaging device having wirings with diffusion prevention film 有权
具有带扩散防止膜的布线的固态成像装置

  • Patent Title: Solid state imaging device having wirings with diffusion prevention film
  • Patent Title (中): 具有带扩散防止膜的布线的固态成像装置
  • Application No.: US12703105
    Application Date: 2010-02-09
  • Publication No.: US08211740B2
    Publication Date: 2012-07-03
  • Inventor: Ikuhiro Yamamura
  • Applicant: Ikuhiro Yamamura
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Rockey, Depke & Lyons, LLC
  • Agent Robert J. Depke
  • Priority: JP2002-129780 20020501
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Solid state imaging device having wirings with diffusion prevention film
Abstract:
To arrange diffusion-inhibitory films 5a, 5b, and 5c for inhibiting the diffusion of a wiring material absent in a region on or above a light receiving unit 2, the diffusion-inhibitory films 5a, 5b, and 5c formed on a region above the light receiving unit 2 are selectively removed. Alternatively, the diffusion-inhibitory films are arranged only on top surfaces of wirings 4a, 4b, and 4c, and only a passivation film 12 and interlayer insulating films 3a, 3b, and 3c are arranged in the region on or above the light receiving unit 2. Thus, with less interface between different insulation films and less reflection of incident light in an incident region, the incident light 13 highly efficiently passes through these insulating films and comes into the light receiving unit 2. The light receiving unit 2 can thereby receive a sufficient quantity of the incident light 13.
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