Invention Grant
US08211746B2 Integrated circuit packaging system with lead frame and method of manufacture thereof
有权
具有引线框架的集成电路封装系统及其制造方法
- Patent Title: Integrated circuit packaging system with lead frame and method of manufacture thereof
- Patent Title (中): 具有引线框架的集成电路封装系统及其制造方法
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Application No.: US13117500Application Date: 2011-05-27
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Publication No.: US08211746B2Publication Date: 2012-07-03
- Inventor: Jong-Woo Ha , TaeWoo Kang , DongSoo Moon
- Applicant: Jong-Woo Ha , TaeWoo Kang , DongSoo Moon
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed; and attaching a base substrate connector to the base substrate directly below the leadframe pillar.
Public/Granted literature
- US20110227206A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-09-22
Information query
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