Invention Grant
- Patent Title: Device and method including a soldering process
- Patent Title (中): 包括焊接工艺的装置和方法
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Application No.: US11944722Application Date: 2007-11-26
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Publication No.: US08211752B2Publication Date: 2012-07-03
- Inventor: Paul Ganitzer , Francisco Javier Santos Rodriguez , Martin Sporn , Daniel Kraft
- Applicant: Paul Ganitzer , Francisco Javier Santos Rodriguez , Martin Sporn , Daniel Kraft
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A device and method of making a device is disclosed. One embodiment provides a substrate. A semiconductor chip is provided having a first surface with a roughness of at least 100 nm. A diffusion soldering process is performed to join the first surface of the semiconductor chip to the substrate.
Public/Granted literature
- US20090134501A1 DEVICE AND METHOD INCLUDING A SOLDERING PROCESS Public/Granted day:2009-05-28
Information query
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