Invention Grant
US08211753B2 Leadframe-based mold array package heat spreader and fabrication method therefor
有权
基于引线框架的模具阵列散热器及其制造方法
- Patent Title: Leadframe-based mold array package heat spreader and fabrication method therefor
- Patent Title (中): 基于引线框架的模具阵列散热器及其制造方法
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Application No.: US10921376Application Date: 2004-08-18
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Publication No.: US08211753B2Publication Date: 2012-07-03
- Inventor: Kambhampati Ramakrishna , Diane Sahakian , Il Kwon Shim
- Applicant: Kambhampati Ramakrishna , Diane Sahakian , Il Kwon Shim
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L23/36
- IPC: H01L23/36
Abstract:
A method for fabricating a heat spreader is provided. Heat spreaders are formed and surrounded by a frame. The heat spreaders and frame are connected to one another by tie bars, the heat spreaders and tie bars having respective upper surfaces. At least portions of the upper surfaces of the tie bars are thinned to reduce the heights of the tie bars at least on a singulation line thereon. The frame is formed to support the heat spreader upper surfaces in an elevated position with respect thereto.
Public/Granted literature
- US20050046012A1 Leadframe-based mold array package heat spreader and fabrication method therefor Public/Granted day:2005-03-03
Information query
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