Invention Grant
US08211784B2 Method for manufacturing a semiconductor device with less leakage current induced by carbon implant
有权
用于生产由碳植入物引起的漏电流较小的半导体器件的方法
- Patent Title: Method for manufacturing a semiconductor device with less leakage current induced by carbon implant
- Patent Title (中): 用于生产由碳植入物引起的漏电流较小的半导体器件的方法
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Application No.: US12588703Application Date: 2009-10-26
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Publication No.: US08211784B2Publication Date: 2012-07-03
- Inventor: Jason Hong , Daniel Tang
- Applicant: Jason Hong , Daniel Tang
- Applicant Address: US CA San Jose
- Assignee: Advanced Ion Beam Technology, Inc.
- Current Assignee: Advanced Ion Beam Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/265

Abstract:
A semiconductor device has at least two main carbon-rich regions and two additional carbon-rich regions. The main carbon-rich regions are separately located in a substrate so that a channel region is located between them. The additional carbon-rich regions are respectively located underneath the main carbon-rich regions. The carbon concentrations is higher in the main carbon-rich regions and lower in the additional carbon-rich regions, and optionally, the absolute value of a gradient of the carbon concentration of the bottom portion of the main carbon-rich regions is higher than the absolute value of a gradient of the carbon concentration of the additional carbon-rich regions. Therefore, the leakage current induced by a lattice mismatch effect at the carbon-rich and the carbon-free interface can be minimized.
Public/Granted literature
- US20110095339A1 Semiconductor device and method for manufacturing the same Public/Granted day:2011-04-28
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