Invention Grant
- Patent Title: Inorganic substrate with a thin silica type glass layer, method of manufacturing the aforementioned substrate, coating agent, and a semiconductor device
- Patent Title (中): 具有薄二氧化硅型玻璃层的无机基板，制造上述基板的方法，涂布剂和半导体器件
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Application No.: US12090694Application Date: 2006-10-23
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Publication No.: US08211993B2Publication Date: 2012-07-03
- Inventor: Yukinari Harimoto , Maki Itoh , Dimitris Elias Katsoulis
- Applicant: Yukinari Harimoto , Maki Itoh , Dimitris Elias Katsoulis
- Applicant Address: JP Chiyoda-ku, Tokyo US MI Midland
- Assignee: Dow Corning Toray Company, Ltd.,Dow Corning Corporation
- Current Assignee: Dow Corning Toray Company, Ltd.,Dow Corning Corporation
- Current Assignee Address: JP Chiyoda-ku, Tokyo US MI Midland
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2005-306720 20051021
- International Application: PCT/JP2006/321587 WO 20061023
- International Announcement: WO2007/046560 WO 20070426
- Main IPC: C08G77/12
- IPC: C08G77/12 ; B05D5/06
Abstract:
A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.
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