Invention Grant
- Patent Title: Circuit board and manufacturing method of the circuit board
- Patent Title (中): 电路板和电路板的制造方法
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Application No.: US11898019Application Date: 2007-09-07
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Publication No.: US08212153B2Publication Date: 2012-07-03
- Inventor: Isao Matsui
- Applicant: Isao Matsui
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-243553 20060908
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A board comprises a through hole including a first opening, a second opening opposite to the first opening, a first conductor formed on a part of the through hole, the first conductor extends from the first opening to a first predetermined position of the through hole, a second conductor formed on a part of the through hole, the second conductor extends from the second opening to a second predetermined position nearer to the second opening than the first predetermined position, and wherein the first conductor alternates with the second conductor with respect to the circumferential direction of the through hole.
Public/Granted literature
- US20080060837A1 Circuit board and manufacturing method of the circuit board Public/Granted day:2008-03-13
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