Invention Grant
- Patent Title: Keypad assembly for electronic devices
- Patent Title (中): 电子设备键盘组件
-
Application No.: US12548059Application Date: 2009-08-26
-
Publication No.: US08212161B2Publication Date: 2012-07-03
- Inventor: Meng-Chieh Chou
- Applicant: Meng-Chieh Chou
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910301521 20090413
- Main IPC: H01H9/26
- IPC: H01H9/26

Abstract:
A keypad assembly includes a PCB, a light guiding board disposed on the PCB, a panel disposed on the light guiding board, a plurality of panel portions made of transparent material, set on the panel, a lighting device disposed on the PCB, and a sensing device disposed on the PCB. when an object touches or slides on/above the surface of the panel portion, the intensity of light sensed by the sensing device changes which causes the current of the four sensors to be changed, thus the sensing device generates a signal to complete a corresponding information input.
Public/Granted literature
- US20100258423A1 KEYPAD ASSEMBLY FOR ELECTRONIC DEVICES Public/Granted day:2010-10-14
Information query