Invention Grant
- Patent Title: Solid-state imaging element
- Patent Title (中): 固态成像元件
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Application No.: US13052903Application Date: 2011-03-21
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Publication No.: US08212214B2Publication Date: 2012-07-03
- Inventor: Hiroto Honda , Hideyuki Funaki
- Applicant: Hiroto Honda , Hideyuki Funaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-246300 20080925
- Main IPC: G01J5/00
- IPC: G01J5/00 ; G01J5/20
Abstract:
It is possible to quickly and readily determine the location of an object. A solid-state imaging element according to an embodiment includes: at least two infrared detectors formed on a semiconductor substrate; an electric interconnect configured to connect the at least two infrared detectors in series; and a comparator unit configured to compare an intermediate voltage of the electric interconnect connecting the infrared detectors in series, with a predetermined reference voltage.
Public/Granted literature
- US20110226953A1 SOLID-STATE IMAGING ELEMENT Public/Granted day:2011-09-22
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