Invention Grant
- Patent Title: Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof
- Patent Title (中): 用于安装光半导体元件的基板，其制造方法，光半导体器件及其制造方法
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Application No.: US12209544Application Date: 2008-09-12
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Publication No.: US08212271B2Publication Date: 2012-07-03
- Inventor: Hayato Kotani , Naoyuki Urasaki , Makoto Mizutani
- Applicant: Hayato Kotani , Naoyuki Urasaki , Makoto Mizutani
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2007-265558 20071011; JPP2008-152649 20080611
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element.
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