Invention Grant
- Patent Title: Vertical LED with conductive vias
- Patent Title (中): 带导电通孔的垂直LED
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Application No.: US12669679Application Date: 2008-07-18
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Publication No.: US08212273B2Publication Date: 2012-07-03
- Inventor: James Stuart McKenzie , Majd Zoorob
- Applicant: James Stuart McKenzie , Majd Zoorob
- Applicant Address: GB Romsey
- Assignee: PhotonStar LED Limited
- Current Assignee: PhotonStar LED Limited
- Current Assignee Address: GB Romsey
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: GB0714139.3 20070719; GB0717094.7 20070903
- International Application: PCT/GB2008/002462 WO 20080718
- International Announcement: WO2009/010762 WO 20090122
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device comprises a novel low-loss array of conductive vias embedded in a dielectric multilayer stack, to act as an electrically-conductive, low-loss, high-reflectivity reflector layer (CVMR). In one example the CVMR stack is employed between a reflective metal bottom contact and a p-GaN semiconductor flip chip layer. The CVMR stack comprises at least (3) layers with at least (2) differing dielectric constants. The conductive vias are arranged such that localized and propagating surface plasmons associated with the structure reside within the electromagnetic stopband of the CVMR stack, which in turn inhibits trapped LED modes coupling into these plasmonic modes, thereby increasing the overall reflectivity of the CVM R. This technique improves optical light extraction and provides a vertical conduction path for optimal current spreading in a semiconductor light emitting device. A light emitting module and method of manufacture are also described.
Public/Granted literature
- US20100213485A1 VERTICAL LED WITH CONDUCTIVE VIAS Public/Granted day:2010-08-26
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