Invention Grant
US08212277B2 Optical semiconductor device module with power supply through uneven contacts
有权
光电半导体器件模块通过不均匀的接触电源供电
- Patent Title: Optical semiconductor device module with power supply through uneven contacts
- Patent Title (中): 光电半导体器件模块通过不均匀的接触电源供电
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Application No.: US12510526Application Date: 2009-07-28
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Publication No.: US08212277B2Publication Date: 2012-07-03
- Inventor: Takaaki Sakai , Norifumi Imazeki , Soji Owada
- Applicant: Takaaki Sakai , Norifumi Imazeki , Soji Owada
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2008-194423 20080729; JP2008-272670 20081023
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, at least one wiring pattern layer formed on a front surface of the mounting substrate, and at least one power supplying portion in contact with the wiring pattern layer, at least one of the power supplying portion and the wiring pattern layer is uneven.
Public/Granted literature
- US20100044745A1 OPTICAL SEMICONDUCTOR DEVICE MODULE WITH POWER SUPPLY THROUGH UNEVEN CONTACTS Public/Granted day:2010-02-25
Information query
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