Invention Grant
- Patent Title: Light emitting package controlling color temperature, fabricating method thereof, color temperature controlling method of light emitting package
- Patent Title (中): 发光封装控制色温,其制造方法,发光封装的色温控制方法
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Application No.: US12710708Application Date: 2010-02-23
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Publication No.: US08212278B2Publication Date: 2012-07-03
- Inventor: Yu-Sik Kim
- Applicant: Yu-Sik Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0016371 20090226
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Provided are a light emitting package capable of controlling a color temperature, a fabricating method thereof, and a color temperature controlling method of the light emitting package. The light emitting package includes a package body, a first electrode and a second electrode formed on the package body and spaced apart from each other, a light emitting element formed on the package body and electrically connected to the first electrode and the second electrode, and a thin film resistor connected in series to the first electrode.
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