Invention Grant
- Patent Title: Semiconductor light receiving element
- Patent Title (中): 半导体光接收元件
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Application No.: US12810089Application Date: 2008-12-25
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Publication No.: US08212286B2Publication Date: 2012-07-03
- Inventor: Emiko Fujii
- Applicant: Emiko Fujii
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2007-334669 20071226
- International Application: PCT/JP2008/003949 WO 20081225
- International Announcement: WO2009/081585 WO 20090702
- Main IPC: H01L31/07
- IPC: H01L31/07 ; H01L27/148 ; H01L23/58

Abstract:
The semiconductor light receiving element 1 includes a semiconductor substrate 101, and a semiconductor layer having a photo-absorption layer 105 disposed on the top of the semiconductor substrate 101. The semiconductor layer of the semiconductor light receiving element 1 containing at least the photo-absorption layer 105 has a mesa structure, and a side wall of the mesa is provided with a protective film 113 covering the side wall. The protective film 113 is a silicon nitride film containing hydrogen, and a hydrogen concentration in one surface of the protective film 113 located at the side of the mesa side wall is lower than a hydrogen concentration in the other surface of the protective film 113 located at the side that is opposite to the side of the mesa side wall.
Public/Granted literature
- US20100276775A1 SEMICONDUCTOR LIGHT RECEIVING ELEMENT Public/Granted day:2010-11-04
Information query
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