Invention Grant
- Patent Title: Compound semiconductor substrate comprising a multilayer buffer layer
- Patent Title (中): 化合物半导体衬底包括多层缓冲层
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Application No.: US12879035Application Date: 2010-09-10
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Publication No.: US08212288B2Publication Date: 2012-07-03
- Inventor: Jun Komiyama , Kenichi Eriguchi , Hiroshi Oishi , Yoshihisa Abe , Akira Yoshida , Shunichi Suzuki
- Applicant: Jun Komiyama , Kenichi Eriguchi , Hiroshi Oishi , Yoshihisa Abe , Akira Yoshida , Shunichi Suzuki
- Applicant Address: JP Shinagawa-Ku, Tokyo
- Assignee: Covalent Materials Corporation
- Current Assignee: Covalent Materials Corporation
- Current Assignee Address: JP Shinagawa-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2009-211189 20090914; JP2010-153634 20100706
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A compound semiconductor substrate which inhibits the generation of a crack or a warp and is preferable for a normally-off type high breakdown voltage device, arranged that a multilayer buffer layer 2 in which AlxGa1-xN single crystal layers (0.6≦X≦1.0) 21 containing carbon from 1×1018 atoms/cm3 to 1×1021 atoms/cm3 and AlyGa1-yN single crystal layers (0.1≦y≦0.5) 22 containing carbon from 1×1017 atoms/cm3 to 1×1021 atoms/cm3 are alternately and repeatedly stacked in order, and a nitride active layer 3 provided with an electron transport layer 31 having a carbon concentration of 5×1017 atoms/cm3 or less and an electron supply layer 32 are deposited on a Si single crystal substrate 1 in order. The carbon concentrations of the AlxGa1-xN single crystal layers 21 and that of the AlGa1-yN single crystal layers 22 respectively decrease from the substrate 1 side towards the above-mentioned active layer 3 side. In this way, the compound semiconductor substrate is produced.
Public/Granted literature
- US20110062556A1 COMPOUND SEMICONDUCTOR SUBSTRATE Public/Granted day:2011-03-17
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