Invention Grant
- Patent Title: Semiconductor device and a method of manufacturing the same, and solid-state image pickup element
- Patent Title (中): 半导体装置及其制造方法以及固体摄像元件
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Application No.: US12778308Application Date: 2010-05-12
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Publication No.: US08212296B2Publication Date: 2012-07-03
- Inventor: Shuji Manda , Hiroshi Takahashi
- Applicant: Shuji Manda , Hiroshi Takahashi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2009-134424 20090603
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
Disclosed herein is a semiconductor device having a vertical MOS transistor having a channel of a first conductivity type and formed by burying a gate electrode in a semiconductor substrate, a planar MOS transistor having a channel of the first conductivity and having a gate electrode formed on the semiconductor substrate, and a planar MOS transistor having a channel of a second conductivity and having a gate electrode formed on the semiconductor substrate, the semiconductor device, including other circuit element(s), other than a transistor, formed either below or above the vertical MOS transistor having the channel of the first conductivity type.
Public/Granted literature
- US20100308385A1 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME, AND SOLID-STATE IMAGE PICKUP ELEMENT Public/Granted day:2010-12-09
Information query
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