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US08212314B2 Semiconductor device and method for manufacturing the same 失效
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method for manufacturing the same
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US12869952
    Application Date: 2010-08-27
  • Publication No.: US08212314B2
    Publication Date: 2012-07-03
  • Inventor: Yuji Sasaki
  • Applicant: Yuji Sasaki
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2009-204662 20090904
  • Main IPC: H01L27/108
  • IPC: H01L27/108
Semiconductor device and method for manufacturing the same
Abstract:
A semiconductor device includes a first conductive type semiconductor substrate; a first conductive type semiconductor region provided thereon in which first conductive type first pillar regions and second conductive type second pillar regions alternately arranged; second conductive type second semiconductor regions provided on second pillar regions in an element region to be in contact with first pillar regions therein; gate electrodes each provided on adjacent second semiconductor regions and on one of the first pillar region interposed therebetween; third semiconductor regions functioning as a first conductive type source region provided in parts of the second semiconductor regions located under side portions of the gate electrodes; and a second conductive type resurf region which is a part of a terminal region surrounding the element region and which is provided on first pillar regions and second pillar regions in the part of the terminal regions.
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