Invention Grant
- Patent Title: Seal ring structure for integrated circuits
- Patent Title (中): 集成电路的密封圈结构
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Application No.: US12850640Application Date: 2010-08-05
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Publication No.: US08212323B2Publication Date: 2012-07-03
- Inventor: Tung-Hsing Lee , Tien-Chang Chang , Yuan-Hung Chung
- Applicant: Tung-Hsing Lee , Tien-Chang Chang , Yuan-Hung Chung
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L31/00 ; H01L23/58 ; H01L29/06
Abstract:
A seal ring structure for an integrated circuit includes a seal ring being disposed along a periphery of the integrated circuit and being divided into at least a first portion and a second portion, wherein the second portion is positioned facing an analog and/or RF circuit block and is different from the first portion in structure. A P+ region is provided in a P substrate and positioned under the second portion. A shallow trench isolation (STI) structure surrounds the P+ region and laterally extends underneath a conductive rampart of the second portion.
Public/Granted literature
- US20100295146A1 SEAL RING STRUCTURE FOR INTEGRATED CIRCUITS Public/Granted day:2010-11-25
Information query
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