A manufacturing method for a micromechanical component having a thin-layer capping. The method includes the following: forming a functional layer on a substrate; structuring the functional layer in first cutout regions having a first width and in regions of the functional layer to be removed having a second width, the second width being substantially greater than the first width; forming a first oxide layer on the structured functional layer; forming a first sealing layer on the thermally oxidized and structured functional layer, the first cutout regions having the first width being sealed; forming a cap layer on the first sealing layer; forming first through holes which extend through the cap layer, the first sealing layer, and the first oxide layer for at least partially exposing the regions of the functional layer to be removed; and selectively removing the regions of the functional layer to be removed, by introducing a first etching medium through the first through holes, resulting in second cutout regions in the functional layer which have the second width.