Invention Grant
- Patent Title: Chip package and manufacturing method thereof
- Patent Title (中): 芯片封装及其制造方法
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Application No.: US12501636Application Date: 2009-07-13
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Publication No.: US08212340B2Publication Date: 2012-07-03
- Inventor: Kuo-Hsien Liao
- Applicant: Kuo-Hsien Liao
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A chip package including a shielding layer conformally covering the underlying molding compound for is provided. The shielding layer can smoothly cover the molding compound and over the rounded or blunted, top edges of the molding compound, which provides better electromagnetic interferences shielding and better shielding performance.
Public/Granted literature
- US20110006408A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-01-13
Information query
IPC分类:
