Invention Grant
- Patent Title: Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires
- Patent Title (中): 用封装引线形成的天线封装集成电路芯片的装置和方法
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Application No.: US12422664Application Date: 2009-04-13
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Publication No.: US08212341B2Publication Date: 2012-07-03
- Inventor: Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
- Applicant: Brian P. Gaucher , Duixian Liu , Ullrich R. Pfeiffer , Thomas M. Zwick
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: F. Chau & Associates, LLC
- Agent Anne V. Dougherty, Esq.
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.
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