Invention Grant
US08212342B2 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
有权
集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
- Patent Title: Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
- Patent Title (中): 集成电路封装系统，其具有带电镀端子引线的可拆卸背衬元件及其制造方法
-
Application No.: US12635695Application Date: 2009-12-10
-
Publication No.: US08212342B2Publication Date: 2012-07-03
- Inventor: Zigmund Ramirez Camacho , Dioscoro A. Merilo , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Dioscoro A. Merilo , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A method of manufacture of an integrated circuit package system includes providing a first frame having a first removable backing element connecting a first die attach pad and a first plurality of terminal leads. A first die is attached to the first die attach pad. A substrate is provided. A second die is attached to the substrate. The first die is attached to the second die with a plurality of die interconnects. The first removable backing element is removed after connecting the first die to the second die.
Public/Granted literature
Information query
IPC分类:
