A semiconductor package having chip using copper process is revealed. A chip using copper process is disposed on a substrate. The substrate has a core layer, a copper circuitry with connecting pads, a patterned diffusion barrier, and a solder mask. The copper circuitry is formed on the core layer. The patterned diffusion barrier has such a pattern identical to the one of the copper circuitry that an upper surface of the copper circuitry is completely covered. The substrate further has a bonding layer formed on a portion of the patterned diffusion barrier inside the solder mask's opening. Therefore, diffusion of copper ions from the copper circuitry of the substrate to the active surface of the chip can be avoided to prevent function failure of the chip.