Invention Grant
- Patent Title: Semiconductor package and manufacturing method of the semiconductor package
- Patent Title (中): 半导体封装的半导体封装和制造方法
-
Application No.: US12760419Application Date: 2010-04-14
-
Publication No.: US08212355B2Publication Date: 2012-07-03
- Inventor: Masahiro Sunohara , Yuichi Taguchi
- Applicant: Masahiro Sunohara , Yuichi Taguchi
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: IPUSA, PLLC
- Priority: JP2009-117921 20090514
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/60 ; H01L21/768 ; H01L23/48
Abstract:
A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.
Public/Granted literature
- US20100289140A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE Public/Granted day:2010-11-18
Information query
IPC分类:
