Invention Grant
US08212370B2 Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
失效
含有聚氨酯酰亚胺树脂和用于制造半导体器件的热固性树脂法的芯片接合用树脂膏和使用该树脂浆料的半导体器件
- Patent Title: Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
- Patent Title (中): 含有聚氨酯酰亚胺树脂和用于制造半导体器件的热固性树脂法的芯片接合用树脂膏和使用该树脂浆料的半导体器件
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Application No.: US12444230Application Date: 2007-09-28
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Publication No.: US08212370B2Publication Date: 2012-07-03
- Inventor: Syuichi Mori , Yuji Hasegawa , Minoru Sugiura
- Applicant: Syuichi Mori , Yuji Hasegawa , Minoru Sugiura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2006-273006 20061004; JPP2007-137005 20070523
- International Application: PCT/JP2007/069038 WO 20070928
- International Announcement: WO2008/041646 WO 20080410
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/50 ; C09J175/04
Abstract:
The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group containing an aromatic ring or aliphatic ring, R2 represents a divalent organic group with a molecular weight of 100-10,000, R3 represents a tetravalent organic group containing 4 or more carbon atoms, and n and m each independently represent an integer of 1-100.]
Public/Granted literature
- US20100155969A1 RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Public/Granted day:2010-06-24
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